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39 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff, S. (2023). Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach (Vol. 15). Shaker.
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2023 | Conference Abstract | LibreCat-ID: 47234
Sehlmeyer, B., Kampmann, R., Scheidemann, C., Hemsel, T., & Getzlaff, M. (2023). Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells. In Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM).
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2023 | Conference Abstract | LibreCat-ID: 47235
Kampmann, R., Sehlmeyer, B., Scheidemann, C., Hemsel, T., & Getzlaff, M. (2023). Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells. In Deutsche Physikalische Gesellschaft e. V. (Ed.), Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM).
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2023 | Conference Abstract | LibreCat-ID: 51117
Scheidemann, C., Hemsel, T., Friesen, O., Claes, L., & Sextro, W. (2023). Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. 7th International Conference on Advanced Electromaterials (ICAE 2023), Jeju, Korea.
LibreCat
2023 | Conference Abstract | LibreCat-ID: 51118
Scheidemann, C., Hemsel, T., Friesen, O., Claes, L., & Sextro, W. (2023). Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Incheon, Korea.
LibreCat
2023 | Conference Abstract | LibreCat-ID: 51119
Scheidemann, C., Hagedorn, O. E. C., Hemsel, T., & Sextro, W. (2023). Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Jeju, Korea.
LibreCat
2022 | Dissertation | LibreCat-ID: 34272 | 
Schemmel, R. (2022). Enhanced process development by simulation of ultrasonic heavy wire bonding (Vol. 13). Shaker. https://doi.org/10.17619/UNIPB/1-1280
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2022 | Conference Paper | LibreCat-ID: 30371
Hagedorn, O. E. C., Broll, M., Kirsch, O., Hemsel, T., & Sextro, W. (2022). Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding. CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, 138–143.
LibreCat
2022 | Conference Paper | LibreCat-ID: 34104
Scheidemann, C., Kirsch, O., Hemsel, T., & Sextro, W. (2022). Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). https://doi.org/10.1109/estc55720.2022.9939478
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2022 | Report | LibreCat-ID: 52045
Scheidemann, C., Hemsel, T., & Sextro, W. (2022). Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University. https://doi.org/10.2314/KXP:1879655276
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2021 | Dissertation | LibreCat-ID: 34274
Eichwald, P. (2021). Prozessgerechte Gestaltung von Werkzeugen auf Basis von Verschleißsimulationen am Beispiel des Ultraschallbondens (Vol. 11). Shaker.
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2021 | Conference Paper | LibreCat-ID: 25265
Dreiling, D., Itner, D., Feldmann, N., Scheidemann, C., Gravenkamp, H., & Henning, B. (2021). Application and modelling of ultrasonic transducers using 1-3 piezoelectric composites with structured electrodes. Fortschritte Der Akustik - DAGA 2021. DAGA 2021 - 47. JAHRESTAGUNG FÜR AKUSTIK, Wien.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077
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2020 | Conference Paper | LibreCat-ID: 17355
Schemmel, R., Scheidemann, C., Hemsel, T., Kirsch, O., & Sextro, W. (2020). Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding. CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 1–6.
LibreCat
2020 | Conference Paper | LibreCat-ID: 17706
Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2020). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). https://doi.org/10.1109/eurosime48426.2020.9152679
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2019 | Conference Paper | LibreCat-ID: 15244
Hagedorn, O. E. C., Pielsticker, D., Hemsel, T., & Sextro, W. (2019). Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen. In 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019.
LibreCat
2019 | Conference Paper | LibreCat-ID: 15412
Schemmel, R., Eacock, F., Dymel, C., Hemsel, T., Hunstig, M., Brökelmann, M., & Sextro, W. (2019). Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding. International Symposium on Microelectronics, 509–514. https://doi.org/10.4071/2380-4505-2019.1.000509
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2019 | Journal Article | LibreCat-ID: 10334
Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., & Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical, 295, 653–662. https://doi.org/10.1016/j.sna.2019.04.025
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| DOI
2018 | Conference Paper | LibreCat-ID: 9992
Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., & Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany) (pp. 1–6).
LibreCat
2018 | Conference Paper | LibreCat-ID: 9993
Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., & Hunstig, M. (2018). Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).
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