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20 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff S. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol 15. Shaker; 2023.
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2023 | Journal Article | LibreCat-ID: 43371
Voswinkel D. Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties. Journal of Manufacturing Processes. 2023;94:10-19. doi:/10.1016/j.jmapro.2023.03.056
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2022 | Journal Article | LibreCat-ID: 33988
Moritzer E, Driediger C. Reactive Direct Bonding of Digital Light Process Components. Macromolecular Symposia. 2022;404(1). doi:10.1002/masy.202100396
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2022 | Conference Paper | LibreCat-ID: 29803
Hesse M, Hunstig M, Timmermann J, Trächtler A. Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design. In: Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM). ; 2022:383-394.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability. 2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
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2019 | Dissertation | LibreCat-ID: 41958
Opdemom H. Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen. Vol 2019,35. Shaker Verlag; 2019.
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2019 | Journal Article | LibreCat-ID: 10334
Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical. 2019;295:653-662. doi:10.1016/j.sna.2019.04.025
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany). ; 2018:1-6.
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2018 | Conference Paper | LibreCat-ID: 9993
Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan). ; 2018:41-44.
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2018 | Conference Paper | LibreCat-ID: 9999
Unger A, Hunstig M, Meyer T, Brökelmann M, Sextro W. Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018. Vol Vol. 2018, No. 1, pp. 000572-000577. ; 2018. doi:10.4071/2380-4505-2018.1.000572
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