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20 Publications
2023 | Dissertation | LibreCat-ID: 41971
@book{Althoff_2023, series={Schriften des Lehrstuhls für Dynamik und Mechatronik}, title={Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach}, volume={15}, publisher={Shaker}, author={Althoff, Simon}, year={2023}, collection={Schriften des Lehrstuhls für Dynamik und Mechatronik} }
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2023 | Journal Article | LibreCat-ID: 43371
@article{Voswinkel_2023, title={Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties}, volume={94}, DOI={/10.1016/j.jmapro.2023.03.056}, journal={Journal of Manufacturing Processes}, publisher={Elsevier}, author={Voswinkel, Dietrich}, year={2023}, pages={10–19} }
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2022 | Journal Article | LibreCat-ID: 33988
@article{Moritzer_Driediger_2022, title={Reactive Direct Bonding of Digital Light Process Components}, volume={404}, DOI={10.1002/masy.202100396}, number={12100396}, journal={Macromolecular Symposia}, publisher={Wiley}, author={Moritzer, Elmar and Driediger, Christine}, year={2022} }
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2022 | Conference Paper | LibreCat-ID: 29803
@inproceedings{Hesse_Hunstig_Timmermann_Trächtler_2022, title={Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design}, booktitle={Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM)}, author={Hesse, Michael and Hunstig, Matthias and Timmermann, Julia and Trächtler, Ansgar}, year={2022}, pages={383–394} }
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2021 | Journal Article | LibreCat-ID: 21436
@article{Schemmel_Krieger_Hemsel_Sextro_2021, title={Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization}, volume={119}, DOI={https://doi.org/10.1016/j.microrel.2021.114077}, journal={Microelectronics Reliability}, author={Schemmel, Reinhard and Krieger, Viktor and Hemsel, Tobias and Sextro, Walter}, year={2021}, pages={114077} }
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2019 | Dissertation | LibreCat-ID: 41958
@book{Opdemom_2019, series={Schriftenreihe Institut für Leichtbau mit Hybridsystemen}, title={Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen}, volume={2019,35}, publisher={Shaker Verlag}, author={Opdemom, Hermann}, year={2019}, collection={Schriftenreihe Institut für Leichtbau mit Hybridsystemen} }
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2019 | Journal Article | LibreCat-ID: 10334
@article{Schemmel_Hemsel_Dymel_Hunstig_Brökelmann_Sextro_2019, title={Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding}, volume={295}, DOI={10.1016/j.sna.2019.04.025}, journal={Sensors and Actuators A: Physical}, author={Schemmel, Reinhard and Hemsel, Tobias and Dymel, Collin and Hunstig, Matthias and Brökelmann, Michael and Sextro, Walter}, year={2019}, pages={653–662} }
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2018 | Conference Paper | LibreCat-ID: 9992
@inproceedings{Dymel_Eichwald_Schemmel_Hemsel_Brökelmann_Hunstig_Sextro_2018, title={Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process}, booktitle={(Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany)}, author={Dymel, Collin and Eichwald, Paul and Schemmel, Reinhard and Hemsel, Tobias and Brökelmann, Michael and Hunstig, Matthias and Sextro, Walter}, year={2018}, pages={1–6} }
LibreCat
2018 | Conference Paper | LibreCat-ID: 9993
@inproceedings{Dymel_Schemmel_Hemsel_Sextro_Brökelmann_Hunstig_2018, title={Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding}, booktitle={(Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan)}, author={Dymel, Collin and Schemmel, Reinhard and Hemsel, Tobias and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias}, year={2018}, pages={41–44} }
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2018 | Conference Paper | LibreCat-ID: 9999
@inproceedings{Unger_Hunstig_Meyer_Brökelmann_Sextro_2018, title={Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges}, volume={Vol. 2018, No. 1, pp. 000572-000577.}, DOI={10.4071/2380-4505-2018.1.000572}, booktitle={In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018}, author={Unger, Andreas and Hunstig, Matthias and Meyer, Tobias and Brökelmann, Michael and Sextro, Walter}, year={2018} }
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