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20 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff, S. (2023). Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach (Vol. 15). Shaker.
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2023 | Journal Article | LibreCat-ID: 43371
Voswinkel, D. (2023). Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties. Journal of Manufacturing Processes, 94, 10–19. https://doi.org//10.1016/j.jmapro.2023.03.056
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2022 | Journal Article | LibreCat-ID: 33988
Moritzer, E., & Driediger, C. (2022). Reactive Direct Bonding of Digital Light Process Components. Macromolecular Symposia, 404(1), Article 2100396. https://doi.org/10.1002/masy.202100396
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2022 | Conference Paper | LibreCat-ID: 29803
Hesse, M., Hunstig, M., Timmermann, J., & Trächtler, A. (2022). Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design. Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 383–394.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, R., Krieger, V., Hemsel, T., & Sextro, W. (2021). Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability, 119, 114077. https://doi.org/10.1016/j.microrel.2021.114077
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2019 | Dissertation | LibreCat-ID: 41958
Opdemom, H. (2019). Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen: Vol. 2019,35. Shaker Verlag.
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2019 | Journal Article | LibreCat-ID: 10334
Schemmel, R., Hemsel, T., Dymel, C., Hunstig, M., Brökelmann, M., & Sextro, W. (2019). Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical, 295, 653–662. https://doi.org/10.1016/j.sna.2019.04.025
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel, C., Eichwald, P., Schemmel, R., Hemsel, T., Brökelmann, M., Hunstig, M., & Sextro, W. (2018). Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany) (pp. 1–6).
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2018 | Conference Paper | LibreCat-ID: 9993
Dymel, C., Schemmel, R., Hemsel, T., Sextro, W., Brökelmann, M., & Hunstig, M. (2018). Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan) (pp. 41–44).
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2018 | Conference Paper | LibreCat-ID: 9999
Unger, A., Hunstig, M., Meyer, T., Brökelmann, M., & Sextro, W. (2018). Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges. In In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018 (Vol. Vol. 2018, No. 1, pp. 000572-000577.). https://doi.org/10.4071/2380-4505-2018.1.000572
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