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20 Publications
2023 | Dissertation | LibreCat-ID: 41971
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach, vol. 15. Shaker, 2023.
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2023 | Journal Article | LibreCat-ID: 43371
D. Voswinkel, “Application of a new strategy for time-efficient laser treatment of galvanized steel substrates to improve the adhesion properties,” Journal of Manufacturing Processes, vol. 94, pp. 10–19, 2023, doi: /10.1016/j.jmapro.2023.03.056.
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2022 | Journal Article | LibreCat-ID: 33988
E. Moritzer and C. Driediger, “Reactive Direct Bonding of Digital Light Process Components,” Macromolecular Symposia, vol. 404, no. 1, Art. no. 2100396, 2022, doi: 10.1002/masy.202100396.
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2022 | Conference Paper | LibreCat-ID: 29803
M. Hesse, M. Hunstig, J. Timmermann, and A. Trächtler, “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-forward Control Design,” in Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), Online, 2022, pp. 383–394.
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2021 | Journal Article | LibreCat-ID: 21436
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.
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2019 | Dissertation | LibreCat-ID: 41958
H. Opdemom, Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen, vol. 2019,35. Shaker Verlag, 2019.
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2019 | Journal Article | LibreCat-ID: 10334
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662, 2019, doi: 10.1016/j.sna.2019.04.025.
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2018 | Conference Paper | LibreCat-ID: 9992
C. Dymel et al., “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
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2018 | Conference Paper | LibreCat-ID: 9993
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig, “Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
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2018 | Conference Paper | LibreCat-ID: 9999
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, and W. Sextro, “Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges,” in In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577.
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