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20 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Shaker, 2023.
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2023 | Journal Article | LibreCat-ID: 43371
Voswinkel, Dietrich. “Application of a New Strategy for Time-Efficient Laser Treatment of Galvanized Steel Substrates to Improve the Adhesion Properties.” Journal of Manufacturing Processes, vol. 94, Elsevier, 2023, pp. 10–19, doi:/10.1016/j.jmapro.2023.03.056.
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2022 | Journal Article | LibreCat-ID: 33988
Moritzer, Elmar, and Christine Driediger. “Reactive Direct Bonding of Digital Light Process Components.” Macromolecular Symposia, vol. 404, no. 1, 2100396, Wiley, 2022, doi:10.1002/masy.202100396.
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2022 | Conference Paper | LibreCat-ID: 29803
Hesse, Michael, et al. “Batch Constrained Bayesian Optimization for UltrasonicWire Bonding Feed-Forward Control Design.” Proceedings of the 11th International Conference on Pattern Recognition Applications and Methods (ICPRAM), 2022, pp. 383–94.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability, vol. 119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
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2019 | Dissertation | LibreCat-ID: 41958
Opdemom, Hermann. Experimentelle Untersuchung einse modifzierten Nasspressverfahrens für die Herstellung von hybriden Metall-Faserverbundkunststoff-Bauteilen. Shaker Verlag, 2019.
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2019 | Journal Article | LibreCat-ID: 10334
Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical, vol. 295, 2019, pp. 653–62, doi:10.1016/j.sna.2019.04.025.
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
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2018 | Conference Paper | LibreCat-ID: 9993
Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
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2018 | Conference Paper | LibreCat-ID: 9999
Unger, Andreas, et al. “Intelligent Production of Wire Bonds Using Multi-Objective Optimization – Insights, Opportunities and Challenges.” In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, vol. Vol. 2018, No. 1, pp. 000572-000577., 2018, doi:10.4071/2380-4505-2018.1.000572.
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