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39 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Vol. 15. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2023.
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2023 | Conference Abstract | LibreCat-ID: 47234
Sehlmeyer, Birte, Rebecca Kampmann, Claus Scheidemann, Tobias Hemsel, and Mathias Getzlaff. “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells.” In Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.
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2023 | Conference Abstract | LibreCat-ID: 47235
Kampmann, Rebecca, Birte Sehlmeyer, Claus Scheidemann, Tobias Hemsel, and Mathias Getzlaff. “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells.” In Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.
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2023 | Conference Abstract | LibreCat-ID: 51117
Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” 2023.
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2023 | Conference Abstract | LibreCat-ID: 51118
Scheidemann, Claus, Tobias Hemsel, Olga Friesen, Leander Claes, and Walter Sextro. “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” 2023.
LibreCat
2023 | Conference Abstract | LibreCat-ID: 51119
Scheidemann, Claus, Oliver Ernst Caspar Hagedorn, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” 2023.
LibreCat
2022 | Dissertation | LibreCat-ID: 34272 | 
Schemmel, Reinhard. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Vol. 13. Schriften Des Lehrstuhls Für Dynamik Und Mechatronik. Shaker, 2022. https://doi.org/10.17619/UNIPB/1-1280.
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2022 | Conference Paper | LibreCat-ID: 30371
Hagedorn, Oliver Ernst Caspar, Marian Broll, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of the Influence of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.” In CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, 138–43. Berlin: VDE VERLAG GMBH, 2022.
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2022 | Conference Paper | LibreCat-ID: 34104
Scheidemann, Claus, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” In 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). IEEE, 2022. https://doi.org/10.1109/estc55720.2022.9939478.
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2022 | Report | LibreCat-ID: 52045
Scheidemann, Claus, Tobias Hemsel, and Walter Sextro. Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University, 2022. https://doi.org/10.2314/KXP:1879655276.
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2021 | Dissertation | LibreCat-ID: 34274
Eichwald, Paul. Prozessgerechte Gestaltung von Werkzeugen auf Basis von Verschleißsimulationen am Beispiel des Ultraschallbondens. Vol. 11. Schriften des Lehrstuhls für Dynamik und Mechatronik. Shaker, 2021.
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2021 | Conference Paper | LibreCat-ID: 25265
Dreiling, Dmitrij, Dominik Itner, Nadine Feldmann, Claus Scheidemann, Hauke Gravenkamp, and Bernd Henning. “Application and Modelling of Ultrasonic Transducers Using 1-3 Piezoelectric Composites with Structured Electrodes.” In Fortschritte Der Akustik - DAGA 2021. Wien: Deutsche Gesellschaft für Akustik e.V. (DEGA), 2021.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.
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2020 | Conference Paper | LibreCat-ID: 17355
Schemmel, Reinhard, Claus Scheidemann, Tobias Hemsel, Olaf Kirsch, and Walter Sextro. “Experimental Analysis and Modelling of Bond Formation in Ultrasonic Heavy Wire Bonding.” In CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 1–6, 2020.
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2020 | Conference Paper | LibreCat-ID: 17706
Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” In 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020. https://doi.org/10.1109/eurosime48426.2020.9152679.
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2019 | Conference Paper | LibreCat-ID: 15244
Hagedorn, Oliver Ernst Caspar, Daniel Pielsticker, Tobias Hemsel, and Walter Sextro. “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen.” In 2. VDI-Fachtagung Schwingungen 2019. VDI Verlag GmbH · Düsseldorf 2019, 2019.
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2019 | Conference Paper | LibreCat-ID: 15412
Schemmel, Reinhard, Florian Eacock, Collin Dymel, Tobias Hemsel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Impact of Multi-Dimensional Vibration Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” In International Symposium on Microelectronics, 509–14, 2019. https://doi.org/10.4071/2380-4505-2019.1.000509.
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2019 | Journal Article | LibreCat-ID: 10334
Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical 295 (2019): 653–62. https://doi.org/10.1016/j.sna.2019.04.025.
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 1–6, 2018.
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2018 | Conference Paper | LibreCat-ID: 9993
Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44, 2018.
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2018 | Conference Paper | LibreCat-ID: 9997
Schemmel, Reinhard, Simon Althoff, Walter Sextro, Andreas Unger, Michael Brökelmann, and Matthias Hunstig. “Effects of Different Working Frequencies on the Joint Formation in Copper Wire Bonding.” In CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), 230–35. Stuttgart, Germany, 2018.
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2018 | Conference Paper | LibreCat-ID: 9998
Schemmel, Reinhard, Tobias Hemsel, and Walter Sextro. “Numerical and Experimental Investigations in Ultrasonic Heavy Wire Bonding.” In 6th European Conference on Computational Mechanics (ECCM 6), 1–12. Glasgow, UK, 2018.
LibreCat
2017 | Journal Article | LibreCat-ID: 9973
Eichwald, Paul, Simon Althoff, Reinhard Schemmel, Walter Sextro, Andreas Unger, Michael Brökelmann, and Matthias Hunstig. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” IMAPSource Vol. 2017, No. 1 (2017).
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2017 | Dissertation | LibreCat-ID: 9986 |
Unger, Andreas. Modellbasierte Mehrzieloptimierung Zur Herstellung von Ultraschall-Drahtbondverbindungen in Leistungshalbleitermodulen. Universität Paderborn, 2017.
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2016 | Conference Paper | LibreCat-ID: 9955
Althoff, Simon, Tobias Meyer, Andreas Unger, Walter Sextro, and Florian Eacock. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” In IEEE 66th Electronic Components and Technology Conference, 2103–10, 2016. https://doi.org/10.1109/ECTC.2016.234.
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2016 | Journal Article | LibreCat-ID: 9957
Brökelmann, Michael, Andreas Unger, Tobias Meyer, Simon Althoff, Walter Sextro, Matthias Hunstig, Florian Biermann, and Karsten Guth. “Kupferbondverbindungen Intelligent Herstellen.” Wt-Online 7/8 (2016): 512–19.
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2016 | Conference Paper | LibreCat-ID: 9959
Eacock, Florian, Andreas Unger, Paul Eichwald, Olexandr Grydin, Florian Hengsbach, Simon Althoff, Mirko Schaper, and Karsten Guth. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” In IEEE 66th Electronic Components and Technology Conference, 2111–18, 2016. https://doi.org/10.1109/ECTC.2016.91.
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2016 | Conference Paper | LibreCat-ID: 9960
Eichwald, Paul, Andreas Unger, Florian Eacock, Simon Althoff, Walter Sextro, Karsten Guth, and Michael Brökelmann. “Micro Wear Modeling in Copper Wire Wedge Bonding.” In IEEE CPMT Symposium Japan, 2016, 2016.
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2016 | Conference Paper | LibreCat-ID: 9966
Meyer , Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” In IEEE 66th Electronic Components and Technology Conference, 622–28, 2016. https://doi.org/10.1109/ECTC.2016.215.
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2016 | Conference Paper | LibreCat-ID: 9968
Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54. IEEE CPMT Symposium Japan, 2016.
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2015 | Conference Paper | LibreCat-ID: 9943
Althoff, Simon, Andreas Unger, Walter Sextro, and Florian Eacock. “Improving the Cleaning Process in Copper Wire Bonding by Adapting Bonding Parameters.” In 2015 17th Electronics Packaging Technology Conference, 1–6, 2015. https://doi.org/10.1109/EPTC.2015.7412402.
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2015 | Conference Paper | LibreCat-ID: 9951
Meyer, Tobias, Andreas Unger, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Modeling and Simulation of the Ultrasonic Wire Bonding Process.” In 2015 17th Electronics Packaging Technology Conference, 2015. https://doi.org/10.1109/EPTC.2015.7412377.
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2015 | Conference Paper | LibreCat-ID: 9954
Unger, Andreas, Walter Sextro, Tobias Meyer, Paul Eichwald, Simon Althoff, Florian Eacock, and Michael Brökelmann. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” In 2015 17th Electronics Packaging Technology Conference, 2015. https://doi.org/10.1109/EPTC.2015.7412375.
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2014 | Conference Paper | LibreCat-ID: 9868
Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” In Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 1549–55, 2014. https://doi.org/10.1109/ECTC.2014.6897500.
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2014 | Conference Paper | LibreCat-ID: 9870
Eacock , Florian, Mirko Schaper, Simon Althoff, Andreas Unger, Paul Eichwald, Florian Hengsbach, Carolin Zinn, Martin Joachim Holzweissig, and Karsten Guth. “Microstructural Investigations of Aluminum and Copper Wire Bonds.” In Proceedings of the 47th International Symposium on Microelectronics, 2014. https://doi.org/10.4071/isom-THP32.
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2014 | Conference Paper | LibreCat-ID: 9895
Unger, Andreas, Walter Sextro, Simon Althoff, Paul Eichwald, Tobias Meyer, Florian Eacock, and Michael Brökelmann. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” In Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 289–94. San Diego, CA, US, 2014.
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2014 | Conference Paper | LibreCat-ID: 9896
Unger, Andreas, Walter Sextro, Simon Althoff, Tobias Meyer, Michael Brökelmann, Klaus Neumann, René Felix Reimann, Karsten Guth, and Daniel Bolowski. “Data-Driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding.” In Proceedings of 8th International Conference on Integrated Power Electronic Systems, 141:175–80, 2014.
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2013 | Conference Paper | LibreCat-ID: 9797
Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction Based Approach for Modeling Wire Bonding.” In IMAPS 2013, 46th International Symposium on Microelectronics. Orlando (Florida), USA, 2013. https://doi.org/10.4071/isom-2013-TA67.
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2013 | Conference Paper | LibreCat-ID: 9799
Eichwald, Paul, Walter Sextro, Simon Althoff, Florian Eacock, Mark Schnietz, Karsten Guth, and Michael Brökelmann. “Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding.” In 15th Electronics Packaging Technology Conference, 2013. https://doi.org/10.1109/EPTC.2013.6745803.
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