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39 Publications
2023 | Dissertation | LibreCat-ID: 41971
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach, vol. 15. Shaker, 2023.
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2023 | Conference Abstract | LibreCat-ID: 47234
B. Sehlmeyer, R. Kampmann, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), Dresden, 2023.
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2023 | Conference Abstract | LibreCat-ID: 47235
R. Kampmann, B. Sehlmeyer, C. Scheidemann, T. Hemsel, and M. Getzlaff, “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells,” in Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), Dresden, 2023.
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2023 | Conference Abstract | LibreCat-ID: 51117
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the 7th International Conference on Advanced Electromaterials (ICAE 2023), Jeju, Korea, 2023.
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2023 | Conference Abstract | LibreCat-ID: 51118
C. Scheidemann, T. Hemsel, O. Friesen, L. Claes, and W. Sextro, “Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics,” presented at the International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Incheon, Korea, 2023.
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2023 | Conference Abstract | LibreCat-ID: 51119
C. Scheidemann, O. E. C. Hagedorn, T. Hemsel, and W. Sextro, “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” presented at the International Conference on Functional Materials & Devices 2023 (ICFMD 2023), Jeju, Korea, 2023.
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2022 | Dissertation | LibreCat-ID: 34272 | 
R. Schemmel, Enhanced process development by simulation of ultrasonic heavy wire bonding, vol. 13. Shaker, 2022.
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2022 | Conference Paper | LibreCat-ID: 30371
O. E. C. Hagedorn, M. Broll, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of the Influence of different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding,” in CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, Berlin, 2022, pp. 138–143.
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2022 | Conference Paper | LibreCat-ID: 34104
C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding,” 2022, doi: 10.1109/estc55720.2022.9939478.
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2022 | Report | LibreCat-ID: 52045
C. Scheidemann, T. Hemsel, and W. Sextro, Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University, 2022.
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2021 | Dissertation | LibreCat-ID: 34274
P. Eichwald, Prozessgerechte Gestaltung von Werkzeugen auf Basis von Verschleißsimulationen am Beispiel des Ultraschallbondens, vol. 11. Shaker, 2021.
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2021 | Conference Paper | LibreCat-ID: 25265
D. Dreiling, D. Itner, N. Feldmann, C. Scheidemann, H. Gravenkamp, and B. Henning, “Application and modelling of ultrasonic transducers using 1-3 piezoelectric composites with structured electrodes,” presented at the DAGA 2021 - 47. JAHRESTAGUNG FÜR AKUSTIK, Wien, 2021.
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2021 | Journal Article | LibreCat-ID: 21436
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” Microelectronics Reliability, vol. 119, p. 114077, 2021, doi: https://doi.org/10.1016/j.microrel.2021.114077.
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| DOI
2020 | Conference Paper | LibreCat-ID: 17355
R. Schemmel, C. Scheidemann, T. Hemsel, O. Kirsch, and W. Sextro, “Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding,” in CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
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2020 | Conference Paper | LibreCat-ID: 17706
R. Schemmel, V. Krieger, T. Hemsel, and W. Sextro, “Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization,” 2020, doi: 10.1109/eurosime48426.2020.9152679.
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| DOI
2019 | Conference Paper | LibreCat-ID: 15244
O. E. C. Hagedorn, D. Pielsticker, T. Hemsel, and W. Sextro, “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen,” in 2. VDI-Fachtagung Schwingungen 2019, 2019.
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2019 | Conference Paper | LibreCat-ID: 15412
R. Schemmel et al., “Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding,” in International Symposium on Microelectronics, Boston, 2019, pp. 509–514, doi: 10.4071/2380-4505-2019.1.000509.
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2019 | Journal Article | LibreCat-ID: 10334
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662, 2019, doi: 10.1016/j.sna.2019.04.025.
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| DOI
2018 | Conference Paper | LibreCat-ID: 9992
C. Dymel et al., “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9993
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig, “Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
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2018 | Conference Paper | LibreCat-ID: 9997
R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig, “Effects of different working frequencies on the joint formation in copper wire bonding,” in CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), 2018, pp. 230–235.
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2018 | Conference Paper | LibreCat-ID: 9998
R. Schemmel, T. Hemsel, and W. Sextro, “Numerical and experimental investigations in ultrasonic heavy wire bonding,” in 6th European Conference on Computational Mechanics (ECCM 6), 2018, pp. 1–12.
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2017 | Journal Article | LibreCat-ID: 9973
P. Eichwald et al., “Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design,” IMAPSource, vol. Vol. 2017, No. 1, 2017.
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2017 | Dissertation | LibreCat-ID: 9986 |
A. Unger, Modellbasierte Mehrzieloptimierung zur Herstellung von Ultraschall-Drahtbondverbindungen in Leistungshalbleitermodulen. Universität Paderborn, 2017.
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2016 | Journal Article | LibreCat-ID: 9957
M. Brökelmann et al., “Kupferbondverbindungen intelligent herstellen,” wt-online, vol. 7/8, pp. 512–519, 2016.
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2016 | Conference Paper | LibreCat-ID: 9960
P. Eichwald et al., “Micro Wear Modeling in Copper Wire Wedge Bonding,” in IEEE CPMT Symposium Japan, 2016, 2016.
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2016 | Conference Paper | LibreCat-ID: 9968
A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–254.
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2014 | Conference Paper | LibreCat-ID: 9895
A. Unger et al., “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds,” in Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–294.
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2014 | Conference Paper | LibreCat-ID: 9896
A. Unger et al., “Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding,” in Proceedings of 8th International Conference on Integrated Power Electronic Systems, 2014, vol. 141, pp. 175–180.
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