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39 Publications
2023 | Dissertation | LibreCat-ID: 41971
Althoff, Simon. Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach. Shaker, 2023.
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2023 | Conference Abstract | LibreCat-ID: 47234
Sehlmeyer, Birte, et al. “Burst Mode of Ultrasonic Resonant Oscillations for Stimulation and Destruction of Tumor Cells.” Frühjahrstagung 2023, Sektion Kondensierte Materie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.
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2023 | Conference Abstract | LibreCat-ID: 47235
Kampmann, Rebecca, et al. “Burst Mode Characteristics of an Ultrasonic Transducer for Treatment of Cancer Cells.” Frühjahrstagung 2023, Sektion Kondensierte Marterie (SKM), edited by Deutsche Physikalische Gesellschaft e. V., 2023.
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2023 | Conference Abstract | LibreCat-ID: 51117
Scheidemann, Claus, et al. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. 2023.
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2023 | Conference Abstract | LibreCat-ID: 51118
Scheidemann, Claus, et al. Influence of Temperature and Pre-Stress on the Piezoelectric Material Behavior of Ring-Shaped Ceramics. 2023.
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2023 | Conference Abstract | LibreCat-ID: 51119
Scheidemann, Claus, et al. Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. 2023.
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2022 | Dissertation | LibreCat-ID: 34272 | 
Schemmel, Reinhard. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Shaker, 2022, doi:10.17619/UNIPB/1-1280.
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2022 | Conference Paper | LibreCat-ID: 30371
Hagedorn, Oliver Ernst Caspar, et al. “Experimental Investigation of the Influence of Different Bond Tool Grooves on the Bond Quality for Ultrasonic Thick Wire Bonding.” CIPS 2022 - 12th International Conference on Integrated Power Electronics Systems, VDE VERLAG GMBH, 2022, pp. 138–43.
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2022 | Conference Paper | LibreCat-ID: 34104
Scheidemann, Claus, et al. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022, doi:10.1109/estc55720.2022.9939478.
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2022 | Report | LibreCat-ID: 52045
Scheidemann, Claus, et al. Modellbasierte Ermittlung optimaler Prozessparameter für neuartige Ultraschallbondverbindungen. LibreCat University, 2022, doi:10.2314/KXP:1879655276.
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2021 | Dissertation | LibreCat-ID: 34274
Eichwald, Paul. Prozessgerechte Gestaltung von Werkzeugen auf Basis von Verschleißsimulationen am Beispiel des Ultraschallbondens. Shaker, 2021.
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2021 | Conference Paper | LibreCat-ID: 25265
Dreiling, Dmitrij, et al. “Application and Modelling of Ultrasonic Transducers Using 1-3 Piezoelectric Composites with Structured Electrodes.” Fortschritte Der Akustik - DAGA 2021, Deutsche Gesellschaft für Akustik e.V. (DEGA), 2021.
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2021 | Journal Article | LibreCat-ID: 21436
Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability, vol. 119, 2021, p. 114077, doi:https://doi.org/10.1016/j.microrel.2021.114077.
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2020 | Conference Paper | LibreCat-ID: 17355
Schemmel, Reinhard, et al. “Experimental Analysis and Modelling of Bond Formation in Ultrasonic Heavy Wire Bonding.” CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, 2020, pp. 1–6.
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2020 | Conference Paper | LibreCat-ID: 17706
Schemmel, Reinhard, et al. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, doi:10.1109/eurosime48426.2020.9152679.
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2019 | Conference Paper | LibreCat-ID: 15244
Hagedorn, Oliver Ernst Caspar, et al. “Messung hochfrequenter In-Plane-Schwingungen mittels Laservibrometrie in räumlich eingeschränkten Umgebungen.” 2. VDI-Fachtagung Schwingungen 2019, VDI Verlag GmbH · Düsseldorf 2019, 2019.
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2019 | Conference Paper | LibreCat-ID: 15412
Schemmel, Reinhard, et al. “Impact of Multi-Dimensional Vibration Trajectories on Quality and Failure Modes in Ultrasonic Bonding.” International Symposium on Microelectronics, 2019, pp. 509–14, doi:10.4071/2380-4505-2019.1.000509.
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2019 | Journal Article | LibreCat-ID: 10334
Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical, vol. 295, 2019, pp. 653–62, doi:10.1016/j.sna.2019.04.025.
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2018 | Conference Paper | LibreCat-ID: 9992
Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
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2018 | Conference Paper | LibreCat-ID: 9993
Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
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2018 | Conference Paper | LibreCat-ID: 9997
Schemmel, Reinhard, et al. “Effects of Different Working Frequencies on the Joint Formation in Copper Wire Bonding.” CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), 2018, pp. 230–35.
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2018 | Conference Paper | LibreCat-ID: 9998
Schemmel, Reinhard, et al. “Numerical and Experimental Investigations in Ultrasonic Heavy Wire Bonding.” 6th European Conference on Computational Mechanics (ECCM 6), 2018, pp. 1–12.
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2017 | Journal Article | LibreCat-ID: 9973
Eichwald, Paul, et al. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” IMAPSource, vol. Vol. 2017, No. 1, 2017.
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2017 | Dissertation | LibreCat-ID: 9986 |
Unger, Andreas. Modellbasierte Mehrzieloptimierung Zur Herstellung von Ultraschall-Drahtbondverbindungen in Leistungshalbleitermodulen. Universität Paderborn, 2017.
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2016 | Conference Paper | LibreCat-ID: 9955
Althoff, Simon, et al. “Shape-Dependent Transmittable Tangential Force of Wire Bond Tools.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2103–10, doi:10.1109/ECTC.2016.234.
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2016 | Journal Article | LibreCat-ID: 9957
Brökelmann, Michael, et al. “Kupferbondverbindungen Intelligent Herstellen.” Wt-Online, vol. 7/8, 2016, pp. 512–19.
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2016 | Conference Paper | LibreCat-ID: 9959
Eacock, Florian, et al. “Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–18, doi:10.1109/ECTC.2016.91.
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2016 | Conference Paper | LibreCat-ID: 9960
Eichwald, Paul, et al. “Micro Wear Modeling in Copper Wire Wedge Bonding.” IEEE CPMT Symposium Japan, 2016, 2016.
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2016 | Conference Paper | LibreCat-ID: 9966
Meyer , Tobias, et al. “Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation.” IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–28, doi:10.1109/ECTC.2016.215.
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2016 | Conference Paper | LibreCat-ID: 9968
Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–54.
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2015 | Conference Paper | LibreCat-ID: 9943
Althoff, Simon, et al. “Improving the Cleaning Process in Copper Wire Bonding by Adapting Bonding Parameters.” 2015 17th Electronics Packaging Technology Conference, 2015, pp. 1–6, doi:10.1109/EPTC.2015.7412402.
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2015 | Conference Paper | LibreCat-ID: 9951
Meyer, Tobias, et al. “Modeling and Simulation of the Ultrasonic Wire Bonding Process.” 2015 17th Electronics Packaging Technology Conference, 2015, doi:10.1109/EPTC.2015.7412377.
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2015 | Conference Paper | LibreCat-ID: 9954
Unger, Andreas, et al. “Modeling of the Stick-Slip Effect in Heavy Copper Wire Bonding to Determine and Reduce Tool Wear.” 2015 17th Electronics Packaging Technology Conference, 2015, doi:10.1109/EPTC.2015.7412375.
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2014 | Conference Paper | LibreCat-ID: 9868
Althoff, Simon, et al. “Improving the Bond Quality of Copper Wire Bonds Using a Friction Model Approach.” Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–55, doi:10.1109/ECTC.2014.6897500.
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2014 | Conference Paper | LibreCat-ID: 9870
Eacock , Florian, et al. “Microstructural Investigations of Aluminum and Copper Wire Bonds.” Proceedings of the 47th International Symposium on Microelectronics, 2014, doi:10.4071/isom-THP32.
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2014 | Conference Paper | LibreCat-ID: 9895
Unger, Andreas, et al. “Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds.” Proceedings of the 47th International Symposium on Microelectronics (IMAPS), 2014, pp. 289–94.
LibreCat
2014 | Conference Paper | LibreCat-ID: 9896
Unger, Andreas, et al. “Data-Driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding.” Proceedings of 8th International Conference on Integrated Power Electronic Systems, vol. 141, 2014, pp. 175–80.
LibreCat
2013 | Conference Paper | LibreCat-ID: 9797
Althoff, Simon, et al. “A Friction Based Approach for Modeling Wire Bonding.” IMAPS 2013, 46th International Symposium on Microelectronics, 2013, doi:10.4071/isom-2013-TA67.
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2013 | Conference Paper | LibreCat-ID: 9799
Eichwald, Paul, et al. “Influences of Bonding Parameters on the Tool Wear for Copper Wire Bonding.” 15th Electronics Packaging Technology Conference, 2013, doi:10.1109/EPTC.2013.6745803.
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