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1 Publication


2015 | Journal Article | LibreCat-ID: 39495
U. Hilleringmann, F. Assion, F. F. Vidor, and G. I. Wirth, “Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology,” Journal of Machine to Machine Communications, vol. 1, no. 3, pp. 197–214, 2015, doi: 10.13052/jmmc2246-137x.131.
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