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1 Publication
2015 | Journal Article | LibreCat-ID: 39495
Hilleringmann U, Assion F, Vidor FF, Wirth GI. Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology. Journal of Machine to Machine Communications. 2015;1(3):197-214. doi:10.13052/jmmc2246-137x.131
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