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1 Publication
2015 | Journal Article | LibreCat-ID: 39495
@article{Hilleringmann_Assion_Vidor_Wirth_2015, title={Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology}, volume={1}, DOI={10.13052/jmmc2246-137x.131}, number={3}, journal={Journal of Machine to Machine Communications}, publisher={River Publishers}, author={Hilleringmann, Ulrich and Assion, F. and Vidor, F. F. and Wirth, G. I.}, year={2015}, pages={197–214} }
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