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1 Publication
2015 | Journal Article | LibreCat-ID: 39495
Hilleringmann, U., Assion, F., Vidor, F. F., & Wirth, G. I. (2015). Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology. Journal of Machine to Machine Communications, 1(3), 197–214. https://doi.org/10.13052/jmmc2246-137x.131
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