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1 Publication
2015 | Journal Article | LibreCat-ID: 39495
Hilleringmann, Ulrich, et al. “Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology.” Journal of Machine to Machine Communications, vol. 1, no. 3, River Publishers, 2015, pp. 197–214, doi:10.13052/jmmc2246-137x.131.
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