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1 Publication
2015 | Journal Article | LibreCat-ID: 39495
Nanometer Scale Electronic Device Integration Using Side-Wall Deposition and Etch-Back Technology
U. Hilleringmann, F. Assion, F.F. Vidor, G.I. Wirth, Journal of Machine to Machine Communications 1 (2015) 197–214.
LibreCat
| DOI
U. Hilleringmann, F. Assion, F.F. Vidor, G.I. Wirth, Journal of Machine to Machine Communications 1 (2015) 197–214.