SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study
L. Wu, S. Abughannam, W. Müller, C. Scheytt, W. Ecker, in: 2nd Workshop on Resiliency in Embedded Electronic Systems (REES), Lausanne, Switzerland, 2017, p. 68.
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Conference Paper
| English
Author
Wu, LiangLibreCat;
Abughannam, SaedLibreCat;
Müller, WolfgangLibreCat;
Scheytt, ChristophLibreCat;
Ecker, Wolfgang
Abstract
This paper presents the design flow of using
sampling technique for fault injection on sche-
matic level. The parameters used in the docu-
ment to calculate the likelihood could be modi-
fied by using more realistic data from the fab.
With the help of the fault simulator, the whole
design flow of the fault effect simulation can be
realized automatically.
Publishing Year
Proceedings Title
2nd Workshop on Resiliency in Embedded Electronic Systems (REES)
Page
68
LibreCat-ID
Cite this
Wu L, Abughannam S, Müller W, Scheytt C, Ecker W. SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study. In: 2nd Workshop on Resiliency in Embedded Electronic Systems (REES). ; 2017:68.
Wu, L., Abughannam, S., Müller, W., Scheytt, C., & Ecker, W. (2017). SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study. 2nd Workshop on Resiliency in Embedded Electronic Systems (REES), 68.
@inproceedings{Wu_Abughannam_Müller_Scheytt_Ecker_2017, place={Lausanne, Switzerland}, title={SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study}, booktitle={2nd Workshop on Resiliency in Embedded Electronic Systems (REES)}, author={Wu, Liang and Abughannam, Saed and Müller, Wolfgang and Scheytt, Christoph and Ecker, Wolfgang}, year={2017}, pages={68} }
Wu, Liang, Saed Abughannam, Wolfgang Müller, Christoph Scheytt, and Wolfgang Ecker. “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study.” In 2nd Workshop on Resiliency in Embedded Electronic Systems (REES), 68. Lausanne, Switzerland, 2017.
L. Wu, S. Abughannam, W. Müller, C. Scheytt, and W. Ecker, “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study,” in 2nd Workshop on Resiliency in Embedded Electronic Systems (REES), 2017, p. 68.
Wu, Liang, et al. “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study.” 2nd Workshop on Resiliency in Embedded Electronic Systems (REES), 2017, p. 68.
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