SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study

L. Wu, S. Abughannam, W. Müller, C. Scheytt, W. Ecker, in: 2nd Workshop on Resiliency in Embedded Electronic Systems (REES), Lausanne, Switzerland, 2017, p. 68.

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Conference Paper | English
Abstract
This paper presents the design flow of using sampling technique for fault injection on sche- matic level. The parameters used in the docu- ment to calculate the likelihood could be modi- fied by using more realistic data from the fab. With the help of the fault simulator, the whole design flow of the fault effect simulation can be realized automatically.
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2nd Workshop on Resiliency in Embedded Electronic Systems (REES)
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68
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Wu L, Abughannam S, Müller W, Scheytt C, Ecker W. SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study. In: 2nd Workshop on Resiliency in Embedded Electronic Systems (REES). ; 2017:68.
Wu, L., Abughannam, S., Müller, W., Scheytt, C., & Ecker, W. (2017). SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study. 2nd Workshop on Resiliency in Embedded Electronic Systems (REES), 68.
@inproceedings{Wu_Abughannam_Müller_Scheytt_Ecker_2017, place={Lausanne, Switzerland}, title={SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study}, booktitle={2nd Workshop on Resiliency in Embedded Electronic Systems (REES)}, author={Wu, Liang and Abughannam, Saed and Müller, Wolfgang and Scheytt, Christoph and Ecker, Wolfgang}, year={2017}, pages={68} }
Wu, Liang, Saed Abughannam, Wolfgang Müller, Christoph Scheytt, and Wolfgang Ecker. “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study.” In 2nd Workshop on Resiliency in Embedded Electronic Systems (REES), 68. Lausanne, Switzerland, 2017.
L. Wu, S. Abughannam, W. Müller, C. Scheytt, and W. Ecker, “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study,” in 2nd Workshop on Resiliency in Embedded Electronic Systems (REES), 2017, p. 68.
Wu, Liang, et al. “SPICE-Level Fault Injection with Likelihood Weighted Random Sampling - A Case Study.” 2nd Workshop on Resiliency in Embedded Electronic Systems (REES), 2017, p. 68.
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